- All sections
- H - Electricity
- H10N - Electric solid-state devices not otherwise provided for
- H10N 30/073 - Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
Patent holdings for IPC class H10N 30/073
Total number of patents in this class: 30
10-year publication summary
|
0
|
0
|
0
|
1
|
2
|
5
|
2
|
1
|
11
|
7
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Soitec | 892 |
13 |
| Murata Manufacturing Co., Ltd. | 22355 |
2 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10525 |
2 |
| Oki Electric Industry Co., Ltd. | 1652 |
1 |
| Hosiden Corporation | 428 |
1 |
| Taiyo Yuden Co., Ltd. | 1809 |
1 |
| Universite de Franche-comte | 178 |
1 |
| Universitetet I Tromso - Norges Arktiske Universitet | 58 |
1 |
| TDK Electronics AG | 863 |
1 |
| GE Precision Healthcare LLC | 1580 |
1 |
| X Display Company Technology Limited | 278 |
1 |
| Vanguard International Semiconductor Singapore Pte. Ltd. | 38 |
1 |
| Ecole Nationale Superieure de Mecanique et des Microtechniques - Ensmm | 6 |
1 |
| META Platforms Technologies, LLC | 4806 |
1 |
| Lee Ventus Ltd | 3 |
1 |
| Omvo Technology Inc. | 1 |
1 |
| Other owners | 0 |